Physical and electrical properties of III-V materials, epitaxy and ion-implantation, GaAs and InP based devices (MESFETs, HEMTs varactors) and Microwave Monolithic Integrated Circuits (MMICs). Cleaning, Photolithography, metal and dielectric deposition, wet and dry etching. Device isolation, ohmic and Schottky contacts, dielectrics, passive component technology, interconnects, via holes, dicing and mounting. Study of the above processes by DC characterization.